Selected references
DFMA Transport Module: Die-Bonding
Nexperia ITEC’s die-bonders have been operating in the field for a decade, but the decision was made to thoroughly review several modules. By applying DFMA (Design for Manufacturing and Assembly) methodologies, the cost of the transport module was reduced by nearly a third.
Cryostat Vibration Isolation
To enhance subatomic particle research, a custom structure was engineered to drastically reduce cryostat vibrations. A multidisciplinary team designed and developed a dual-frame vibration isolation solution.
Flow & Temperature Systems
Achieving nanometer-level positioning accuracy in semiconductor manufacturing equipment demands exceptional thermal stability and rigorous contamination control.