![ACE development en engineering hightech systemen](/sites/default/files/styles/icon/public/business-unit/icons/hightech.png?itok=LmgkgxSo)
references
![](/sites/default/files/styles/card/public/2021-02/diebonder%2001.jpg?h=0f57b29b&itok=raQ5xsRz)
DFMA transport module die-bonding
Nexperia ITEC’s die-bonders have been around for ten years, but it was decided to review some of the modules. Using the DFMA method, the price of the transport module fell by almost a third.
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cryostat vibration isolation
For improved subatomic particle research, ACE has designed a construction that reduces the vibrations of the cryostat. A multidisciplinary team designed and realised a solution for vibration isolation with a double frame.
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FLOW & TEMPERATURE SYSTEMS
To achieve nanometre positioning accuracy in semiconductor production machines, high temperature stability and contamination control is crucial.